ASQ24 DC-DC Converter Series Data Sheet
18 to 36 VDC Input; 1.0 to 12 VDC Output
copper, were used to provide traces for connectivity to the
converter.
The lack of metalization on the outer layers as well as the
limited thermal connection ensured that heat transfer from
the converter to the PWB was minimized. This provides a
worst-case but consistent scenario for thermal derating pur-
poses.
All measurements requiring airflow were made in vertical
and horizontal wind tunnel facilities using Infrared (IR) ther-
mography and thermocouples for thermometry.
Ensuring components on the converter do not exceed their
ratings is important to maintaining high reliability. If one an-
ticipates operating the converter at or close to the maximum
loads specified in the derating curves, it is prudent to check
actual operating temperatures in the application. Thermo-
graphic imaging is preferable; if this capability is not availa-
ble, then thermocouples may be used. Power-One recom-
mends the use of AWG #40 gauge thermocouples to ensure
measurement accuracy. Careful routing of the thermocouple
leads will further minimize measurement error. Refer to Fig-
ure H for optimum measuring thermocouple location.
Thermal Derating
Load current vs. ambient temperature and airflow rates are
given in Fig. x.1 for through-hole version. Ambient tempera-
ture was varied between 25°C and 85°C, with airflow rates
from 30 to 500 LFM (0.15 to 2.5m/s), and vertical and hori-
zontal converter mounting.
For each set of conditions, the maximum load current was
defined as the lowest of:
(i) The output current at which any FET junction temperature
does not exceed a maximum specified temperature (120 °C)
as indicated by the thermographic image, or
(ii) The nominal rating of the converter (4 A on 12 V, 5.3 A
on 8.0 V, 8 A on 6.0 V, 10 A on 5.0 V, and 15 A on 3.3 –
1.0V).
During normal operation, derating curves with maximum FET
temperature less than or equal to 120 °C should not be ex-
ceeded. Temperature on the PCB at the thermocouple loca-
tion shown in Fig. H should not exceed 118 °C in order to
operate inside the derating curves.
Fig. H: Location of the thermocouple for thermal testing.
Efficiency
Fig. x.5 shows the efficiency vs. load current plot for ambient
temperature of 25 oC, airflow rate of 300 LFM (1.5 m/s) with
vertical mounting and input voltages of 18 V, 24 V and 36 V.
Also, a plot of efficiency vs. load current, as a function of
ambient temperature with Vin = 24 V, airflow rate of 200 LFM
(1 m/s) with vertical mounting is shown in Fig. x.6.
Power Dissipation
Fig. x.7 shows the power dissipation vs. load current plot for
Ta = 25 oC, airflow rate of 300 LFM (1.5 m/s) with vertical
mounting and input voltages of 18 V, 24 V and 36 V. Also, a
plot of power dissipation vs. load current, as a function of
ambient temperature with Vin = 24 V, airflow rate of 200 LFM
(1 m/s) with vertical mounting is shown in Fig. x.8.
Start-up
Output voltage waveforms, during the turn-on transient using
the ON/OFF pin for full rated load currents (resistive load)
are shown without and with external load capacitance in
Fig. x.9 and Fig. x.10, respectively.
Ripple and Noise
Fig. x.13 shows the output voltage ripple waveform, meas-
ured at full rated load current with a 10 μF tantalum and 1 μF
ceramic capacitor across the output. Note that all output vol-
tage waveforms are measured across a 1 ? F ceramic capa-
citor.
The input reflected ripple current waveforms are obtained
using the test setup shown in Fig x.14. The corresponding
waveforms are shown in Fig. x.15 and Fig. x.16.
MCD10004 Rev. 1.4, 10-Jun-10
Page 6 of 70
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